34
Atmel AT30TSE002B [DATASHEET]
8711GSEEPR5/12
16. Package Drawings
16.1 8M2 8-lead WDFN
TITLE
DRAWING NO.
GPC
REV.
Package Drawing Contact:
packagedrawings@atmel.com
8M2
YDL
A
8M2, 8-lead 2.0x3.0 mm Body, 0.50 mm Pitch,
WDFN, Very Very Thin, Dual No Lead Package
(Sawn)
6/12/09
Notes: 1. This drawing is for general information only. Refer to JEDEC Drawing MO-229, WCED-3, for proper dimensions,
tolerances, datums, etc.
2. Dimension b applies to metallized terminal and is measured between 0.15 mm and 0.30 mm from the terminal tip. If the
terminal has the optional radius on the other end of the terminal, the dimension should not be measured in that radius area.
3. Soldering the large thermal pad is optional, but not recommended. No electrical connection is accomplished to the
device through this pad, so if soldered it should be tied to ground
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL MIN
NOM
MAX NOTE
D
2.00 BSC
E
3.00 BSC
D2
1.35
1.40
1.45
E2
1.25
1.30
1.35
A
0.70
0.75
0.80
A1
0.0
0.02
0.05
A3
0.20 REF
L
0.35
0.40
0.45
e
0.50 BSC
b
0.18
0.25
0.30
2
b
(8X)
(8X)
Pin 1 ID
Pin 1 ID
Pin 1
Pin 1
Index
Index
Area
Area
A1
A1
A3
A3
D
A
L (8X)
L (8X)
e (6X)
e (6X)
1.50 REF.
1.50 REF.
D2
D2
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